| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9f6be6dc36ecc0498e0e9fe880e52822 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-567 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-50 |
| filingDate |
2007-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd699c90fb2b9d3a322ae4bad19fdd32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d684471f3a423b89125c69b8e3e7b229
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a7afdcd795fb65582bbaac2cfa0770d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3c64faa60a03b90f408931cc72f36cc |
| publicationDate |
2007-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007262573-A |
| titleOfInvention |
Palladium plating solution |
| abstract |
PROBLEM TO BE SOLVED: To form a palladium plating film capable of further improving the solder characteristics in a surface treatment having a structure of a nickel plating film, a palladium plating film and a gold plating film on a conductor surface formed of a metal such as copper. A plating solution is provided. A palladium plating solution containing a soluble palladium salt and a conductive salt has a liquid composition containing germanium, and the amount of the soluble palladium salt is 0.1 g / L to 50 g / L in terms of palladium metal. The salt was 10 g / L to 400 g / L, and the germanium was 0.1 mg / L to 1000 mg / L. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11702437-B2 |
| priorityDate |
2006-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |