| abstract |
Disclosed is a palladium plating solution for electrolysis that provides a plating film excellent in solder wettability, wire bonding strength, etc. even when it is thinned, and a lead frame excellent in the above performance. A palladium plating solution for electrolysis comprising a water-soluble palladium salt, and optionally substituted naphthalene monosulfonic acid, naphthalene disulfonic acid or a salt thereof, and using the same A lead frame in which the formed electrolytic palladium plating film, the electrolytic nickel plating film, the electrolytic palladium plating film, and the electrolytic gold plating film are sequentially formed. [Selection figure] None |