abstract |
【Task】 It is an object of the present invention to provide a composition that is excellent in high thermal conductivity and high heat resistance, and further achieves improvement in productivity because it can be directly applied to a heating element or a radiator. [Solution] It has a heat conductivity characterized by containing a thermal conductivity imparting agent, having a melt viscosity of 10,000 to 3,000,000 mPa · s at 200 ° C., and a thermal conductivity of 0.4 W / mK or more. Thermally conductive hot melt adhesive composition. [Selection figure] None |