| abstract |
A resin that has high flame resistance without using halogen, does not change the properties of the resin composition or prepreg over a long period of time, and does not cause a significant decrease in glass transition point or heat resistance. A composition and a laminate for a printed wiring board are provided. (A) a compound having a dihydrobenzoxazine ring in the molecule, (b) a polycondensate of a compound having a phenol and a triazine ring and an aldehyde, (c) an epoxy resin, (d) 9,10- A resin composition comprising dihydro-9-oxa-10- (2,5-dioxotetrahydro-3-furanylmethyl) -10-phosphaphenanthrene-10-oxide, (e) an inorganic filler. [Selection figure] None |