http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007258614-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
filingDate 2006-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d3dcfbc73154d8d601ae40311f9f459a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9730d00988000c5fded79e562a52da6
publicationDate 2007-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007258614-A
titleOfInvention Method for forming metal wiring and metal wiring
abstract It is possible to form a thinner metal wiring more easily and cheaply than a conventional forming method using a vacuum apparatus and without causing disconnection or the like as compared with an ink jet printing method. Provided are a method for forming a metal wiring, and a metal wiring formed by the above-described forming method. A forming method is to apply a dispersion containing metal particles having an average particle size of 100 nm or less to a surface of a substrate to form a coating film, and an average crystal particle size in the coating film after drying is 500 nm. Drying is performed under conditions that maintain the following ranges, and a pattern is formed into a predetermined planar shape by etching, followed by baking. The metal wiring has a sum of the maximum value of the indentation amount and the maximum value of the protrusion amount from the assumed outer shape line in the surface direction of the base material at the edge portion or 50 nm or less, The crossing angle of the outer shape line in the thickness direction at the portion in contact with the surface of the substrate is set to 70 ° or less. [Selection figure] None
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