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filingDate 2006-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007254637-A
titleOfInvention Thermally conductive filler, thermally conductive resin composite, and method for producing thermally conductive filler
abstract PROBLEM TO BE SOLVED: To provide a heat conductive filler capable of sufficiently improving the heat conductivity of a resin composite material. SOLUTION: A thermally conductive filler comprising an elongated substrate and fine zinc oxide directly bonded to the surface of the substrate, wherein the substrate is the following (a 1 ), (a 2 ), Conditions for (a 3 ) and (a 4 ): (A 1 ) Thermal conductivity at 25 ° C. is 0.5 W / mk or more (a 2 ) Average diameter is 0.1 μm to 5 μm (A 3 ) The average length is 0.5 μm to 500 μm (A 4) the average aspect ratio is 5 to 500 And the ratio of the zinc oxide in the filler is 30% by volume to 90% by volume. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012054165-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009249226-A
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