http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007246897-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate | 2007-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb767ad5b077c651bd64a4db31cc62c1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_142f92c8fcb0f6ffb317b93785946098 |
| publicationDate | 2007-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007246897-A |
| titleOfInvention | Heat resistant resin paste, method for producing heat resistant resin paste, and semiconductor device having insulating film or protective film obtained from heat resistant resin paste |
| abstract | A heat-resistant resin paste having excellent rheological properties in a screen printing method or a dispensing method and having excellent wettability to a substrate, a method for efficiently producing the heat-resistant resin paste, and heat resistance Provided is a semiconductor device having an insulating film or a protective film obtained from a resin paste. A heat-resistant resin solution containing a heat-resistant resin (B) soluble in (a) a first organic solvent (A1) and (A1), (b) a first organic solvent (A1), a second A heat-resistant resin filler dispersion containing a heat-resistant resin (C) insoluble in the second organic solvent (A2) and a mixed solvent of (A1) and (A2), and having 2 to 51 siloxane bonds in the molecule It is a heat-resistant resin paste formed by blending a siloxane resin (D) having a silicone diamine compound as a component, and the silicone diamine content in the siloxane resin (D) is 1 to 80 parts per 100 moles of the total diamine. It is obtained from a heat-resistant resin paste that is a molar part. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013108784-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101690058-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160075895-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013218831-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104157694-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013218830-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9024312-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011233858-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020113597-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013218829-A |
| priorityDate | 2006-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 114.