http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007246720-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be92719b856db86c092cc233e9512ca2 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 |
filingDate | 2006-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8093d04e0f1b36f3536297911cfd8813 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4916c531a8f44c9720a28d2eea86c1f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b98c82d577d8b602216f7609d4dd4fe2 |
publicationDate | 2007-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2007246720-A |
titleOfInvention | Heat-sensitive adhesive and heat-sensitive adhesive sheet |
abstract | The present invention provides a heat-sensitive adhesive and a heat-sensitive pressure-sensitive adhesive sheet that overcome the drawbacks of conventional heat-sensitive adhesives and are excellent in adhesive strength to various adherends and in stability of adhesive strength over time. In a heat-sensitive adhesive mainly composed of a thermoplastic resin and a heat-meltable substance that melts upon heating, the following general formula (I) is used as a dispersant for a heat-meltable substance dispersion used for preparing a heat-sensitive adhesive. A heat-sensitive adhesive, characterized by using a compound represented by Formula (I) (N and m are integers and have a molecular weight of 500 or more) [Selection figure] None |
priorityDate | 2006-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 252.