| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1651
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1893
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-184 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
2006-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20ba0fc73a346b5e2d5cea1fe0aa7d36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_928d2ccaac4e58436824cb4cf20f83d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bfbc4e69a85409fc1112a9dd551d11b4 |
| publicationDate |
2007-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007243034-A |
| titleOfInvention |
Wiring board manufacturing method |
| abstract |
A method of manufacturing a wiring board that accurately forms highly reliable high-density wiring with good conductive characteristics. A method of manufacturing a wiring board according to the present invention is a method of manufacturing a wiring board by an electroless plating method, comprising: (a) forming a catalyst layer 32 having a predetermined pattern on a substrate; And (b) providing the first metal layer 34 by immersing the substrate in a first electroless plating solution containing a first metal, thereby precipitating the first metal on the catalyst layer. (C) By immersing the substrate in a second electroless plating solution containing a second metal, the second metal is deposited on the upper surface of the first metal layer, and the second metal layer 37. And the ionization tendency of the first metal is greater than the ionization tendency of the second metal. [Selection] Figure 11 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011114241-A |
| priorityDate |
2006-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |