http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007240976-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2006-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4fd220c8e594f4d931fdf5226b401ff4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44abe896688ed30a019a8ac9809792bf |
| publicationDate | 2007-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007240976-A |
| titleOfInvention | Photosensitive resin composition and method for manufacturing semiconductor device using the same |
| abstract | Photosensitive resin composition capable of producing relief structure having heat resistance, high sensitivity, small film loss, excellent film thickness uniformity in wafer after development, and film thickness uniformity after curing And a method for manufacturing a semiconductor device using the composition. A polybenzoxazole precursor containing a naphthoquinonediazide group, a naphthoquinonediazide photosensitizer, a photosensitive resin composition containing a specific phenolic hydroxyl group-containing compound, and a semiconductor device using the composition Manufacturing method. [Selection figure] None |
| priorityDate | 2006-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 154.