http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007238980-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_646018b7183a929bbb6e26dcdb62a8da |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-34 |
| filingDate | 2006-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_778a86793cbb80ab2367ccb187ebf6d7 |
| publicationDate | 2007-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007238980-A |
| titleOfInvention | Electrolytic aluminum plating method and aluminum plating member |
| abstract | Disclosed is an electrolytic aluminum plating method that can form an aluminum plating film on a concave portion of an object to be plated having a concave portion, and an object to be plated on which the aluminum plating film is formed also on the concave portion. A first stage electrolytic aluminum plating process for forming an aluminum plating film on an object to be plated, a non-conducting process for forming an electrical insulating layer on the surface of the aluminum plating film, and a first stage electrolytic aluminum plating process. An electrolytic aluminum plating method comprising: a second stage electrolytic aluminum plating step of forming an aluminum plating film on a surface of an object to be plated on which an aluminum plating film is not formed. [Selection] Figure 1 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5403053-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2011001932-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009099853-A |
| priorityDate | 2006-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.