http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007238781-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2006-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_893822b06aa1b871c37b5247810a8e17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fb7d918ea8d0fa3c21d170c26841574 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bf27b15f969ca035ab9b706a455dbe2 |
| publicationDate | 2007-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007238781-A |
| titleOfInvention | Liquid encapsulating resin composition and semiconductor device using the same |
| abstract | In a semiconductor device using a liquid encapsulating resin composition, a liquid encapsulating resin composition that cures in a short time even at a relatively low temperature and has excellent storability is provided. A liquid encapsulating resin comprising (A) an epoxy resin that is liquid at 25 ° C., (B) a curing agent, and (C) a compound that generates an acid upon heating is provided. In the present invention, since the thermal acid generator is used as a curing accelerator, it cures in a short time even at a low temperature and has excellent storage stability. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013166917-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010047760-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023176820-A1 |
| priorityDate | 2006-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 167.