| abstract |
PROBLEM TO BE SOLVED: To provide an organic insulating material from which a resin film having a high elastic modulus and excellent adhesion can be obtained, and to provide a semiconductor device using the organic insulating material. An organic insulating material comprising a compound represented by the following general formula (1), a polymer obtained by polymerizing the compound, or a mixture of the compound and the polymer. (X represents an aromatic group, and the hydrogen atom on the aromatic group in X may be substituted with a group containing an adamantane structure which may have an alkyl group having 1 to 20 carbon atoms. A 1 and A 2 represent an organic group containing an acetylene bond, and n 1 and n 2 represent an integer of 1 to 5. [Selection figure] None |