http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007237543-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate | 2006-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67c7ebce5e7b407592403670fd8e6a74 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_666680f5646defad712fcf627b36cc16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bdd4b3009f4fdbc186d897d71d3385ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b994a9d0e27dfe5ee5ea5b24920afde |
| publicationDate | 2007-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007237543-A |
| titleOfInvention | Metallized polyimide film and method for producing the same |
| abstract | Metallization that can be used for flexible printed wiring boards with miniaturized wiring patterns that can accommodate downsizing, weight reduction, and high-density wiring of devices that do not contain factors that greatly affect insulation, such as sulfate ions A polyimide film is provided. A metallized polyimide film in which a metal layer having a thickness of 0.5 to 5 μm formed by a dry film-forming method is formed on at least one surface of a polyimide film having a thickness of 1 to 10 μm, and is formed at 300 ° C. A metallized polyimide film having a curl degree of 10% or less after hot air treatment for 10 minutes. [Selection figure] None |
| priorityDate | 2006-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 181.