http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007235126-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J113-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J125-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L15-00 |
| filingDate | 2007-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad5e06ba6a22ca06d6433a04d82924fe http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1ce38a5efd36399a0b269ec25349625 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97f95b7fb04d3c0c080b87a4df6de445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e98eaea149d7ae118e3b3ef405a7912 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46937d919a3491d8d3d46f2b0961d266 |
| publicationDate | 2007-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007235126-A |
| titleOfInvention | Resin paste for die bonding, semiconductor device using the resin paste, and manufacturing method thereof |
| abstract | Die bonding that can be easily supplied and applied by a printing method to a support member that needs to paste a semiconductor element at a relatively low temperature, and can suppress void generation and thickness reduction after post-curing. It is an object of the present invention to provide a resin paste for semiconductors, a semiconductor device using the resin paste, and a manufacturing method thereof. SOLUTION: (A) At least one liquid rubber component selected from (A) acrylic ester compound or methacrylic ester compound, (B) epoxidized polybutadiene and carboxy-terminated acrylonitrile butadiene copolymer, (C) radical initiator , (D) a non-conductive filler and (E) a spacer filler, a viscosity at 25 ° C. of 5 to 1000 Pa · s, a thixotropy index of 1.5 to 8.0, a rate of change in viscosity with time at room temperature (48 Resin paste for die bonding whose (time) is ± 20% or less, a semiconductor device using the same, and a manufacturing method thereof. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012142439-A |
| priorityDate | 2006-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 250.