http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007224219-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2006-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c7cc1048f6c2ad9ec0be2ecca9d3c885 |
| publicationDate | 2007-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007224219-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | The present invention provides an epoxy resin composition for semiconductor encapsulation, which is excellent in low-stress characteristics, high-temperature storage characteristics, moisture resistance reliability, and solder resistance. SOLUTION: (A) an epoxy resin, (B) a phenol resin-based curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) a butadiene / acrylonitrile copolymer having carboxyl groups at both ends. An epoxy resin composition containing a liquid low-stress agent as a main component, and further comprising (F) a non-phosphorus antioxidant, and a semiconductor by means of a cured product of the epoxy resin composition for semiconductor encapsulation A semiconductor device in which an element is sealed. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2016181591-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011001424-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101234845-B1 |
| priorityDate | 2006-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.