http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007220735-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6dd74b20fbf2e0ebf10c7bfad4f6c8c5
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2006-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3c5f90e0447afb1c3805f8a34e1d63a
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publicationDate 2007-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007220735-A
titleOfInvention Method for manufacturing multilayer printed wiring board having flying tail portion
abstract A flying tail part is protected from a liquid used in an intermediate process such as a plating process or an etching process in a slit method, and the flying tail part is secured. In a substrate stacking process of an inner layer substrate and an outer layer substrate, a slit 33 of the outer layer substrate 30 is located outside an opening 41 of an adhesive 40 between the two substrates 10 and 30, and both side surfaces of the slit 33 are disposed. The distance d between the side surface 33a to be the edge 34a of the portion 34 to be removed on the flying tail portion 2 of 33a and 33b and the edge 41a of the adhesive material opening 41 is 0 mm or more and 0.2 mm or less. It has the process of bonding the adhesive 40 having the opening 41 and the outer layer substrate 30 with the slit 33, and the portion 14 corresponding to the flying tail portion 2 of the inner layer substrate 10 is applied to the copper plating solution before the lamination step. An etching resist 20 having resistance is formed, and the etching resist 20 is peeled off after the step of exposing the flying tail portion 2. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10034368-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112638043-A
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priorityDate 2006-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 22.