| abstract |
The object of the present invention is to have a high solubility in an organic solvent, and when the protective film is formed as a coating forming material on the surface of a printed wiring board, the film has high heat resistance, non-curl property, and adhesion at the same time. A polyimide resin is provided. At least a polyimide resin having a repeating unit represented by the following general formula is used. [Selection figure] None |