| abstract |
【Task】 In a flip chip mounting method using a solder electrode, a sealing structure is provided that prevents cracks and peeling occurring at a joint portion between a semiconductor chip and a solder electrode, a joint portion between a circuit board and a solder electrode, and the like. [Solution] The semiconductor chip 1 is electrically connected to the pad portion 5 on the circuit board 6 through the solder electrode 3. A joint portion between the semiconductor chip 1 and the solder electrode 3 is fixed by a first fixing portion 2 made of a first resin material. The first fixing portion 2 made of the first resin material is provided in a layered manner on the surface of the semiconductor chip 1 on the solder electrode 3 side. Further, the joint portion between the solder electrode 3 and the pad portion 5 on the circuit board 6 is fixed by a second fixing portion 4 made of a second resin material. The second fixing part 4 made of the second resin material is made of a resin material different from the first fixing part 2 made of the first resin material. [Selection] Figure 1 |