http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007212479-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N21-956
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01B11-30
filingDate 2007-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_571681b1d6dac5d9e2c85d405e5eb30d
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publicationDate 2007-08-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007212479-A
titleOfInvention Defect inspection apparatus and method
abstract PROBLEM TO BE SOLVED: To provide scratches having various shapes generated on a surface of a workpiece (for example, an insulating film on a semiconductor substrate) when polishing or grinding such as CMP is performed in semiconductor manufacturing or magnetic head manufacturing. It is an object of the present invention to provide a defect inspection apparatus and method capable of discriminating and inspecting adhered foreign substances. SOLUTION: The present invention performs epi-illumination and oblique illumination with substantially the same light flux on scratches or foreign matters generated on the surface of a polished or ground insulating film, and during the epi-illumination and oblique illumination. It is characterized in that the shallow scratches and the foreign matter are discriminated based on the correlation such as the ratio of the intensity of scattered light generated from the shallow scratches and the foreign matter. [Selection] Figure 1
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6918434-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112945131-A
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priorityDate 2007-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.