http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007204679-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate | 2006-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3a3c8b972120fefdae22445236dff1f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8143b1dddf3e66be8e2e70ac832b4718 |
publicationDate | 2007-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2007204679-A |
titleOfInvention | Epoxy resin composition for semiconductor encapsulation, method for producing the same, and semiconductor device obtained using the same |
abstract | An epoxy resin composition for semiconductor encapsulation having excellent adhesion to a lead frame and excellent solder resistance and a method for producing the same. A triazine dithiol compound represented by the following general formula (1) is blended in a specific ratio with a melting curing agent and melt-mixed to prepare a molten mixture. Then, the remaining compounding component containing an epoxy resin (A component) and an inorganic filler (C component) is mix | blended with the said molten mixture, and the epoxy resin composition for semiconductor sealing is manufactured. Thus, an epoxy resin for semiconductor encapsulation containing an epoxy resin (component A), a molten mixture of the above-described curing agent and the triazine dithiol compound represented by the general formula (1) (component B), and an inorganic filler (component C) A composition is obtained. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014031461-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007224167-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017131390-A1 |
priorityDate | 2006-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.