http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007204679-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-66
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filingDate 2006-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3a3c8b972120fefdae22445236dff1f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8143b1dddf3e66be8e2e70ac832b4718
publicationDate 2007-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007204679-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation, method for producing the same, and semiconductor device obtained using the same
abstract An epoxy resin composition for semiconductor encapsulation having excellent adhesion to a lead frame and excellent solder resistance and a method for producing the same. A triazine dithiol compound represented by the following general formula (1) is blended in a specific ratio with a melting curing agent and melt-mixed to prepare a molten mixture. Then, the remaining compounding component containing an epoxy resin (A component) and an inorganic filler (C component) is mix | blended with the said molten mixture, and the epoxy resin composition for semiconductor sealing is manufactured. Thus, an epoxy resin for semiconductor encapsulation containing an epoxy resin (component A), a molten mixture of the above-described curing agent and the triazine dithiol compound represented by the general formula (1) (component B), and an inorganic filler (component C) A composition is obtained. [Selection figure] None
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priorityDate 2006-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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