http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007203417-A

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publicationDate 2007-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007203417-A
titleOfInvention Saw wire, saw wire manufacturing method, semiconductor ingot cutting method, and wire saw
abstract A saw wire suitable for slicing an ingot or the like by a fixed abrasive method capable of slicing an ingot without using a slurry containing free abrasive grains, having a high surface hardness and a long life. A highly durable saw wire and a method for cutting a semiconductor ingot using the saw wire are provided. And the manufacturing method suitable for manufacture of saw wire is provided. A saw wire in which a diamond thin film or a diamond-like thin film 2 is attached to wire bases 1A, 1B, and 1C, and a convex portion is formed on the surface of the saw wire is used. [Selection] Figure 1
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