abstract |
A saw wire suitable for slicing an ingot or the like by a fixed abrasive method capable of slicing an ingot without using a slurry containing free abrasive grains, having a high surface hardness and a long life. A highly durable saw wire and a method for cutting a semiconductor ingot using the saw wire are provided. And the manufacturing method suitable for manufacture of saw wire is provided. A saw wire in which a diamond thin film or a diamond-like thin film 2 is attached to wire bases 1A, 1B, and 1C, and a convex portion is formed on the surface of the saw wire is used. [Selection] Figure 1 |