http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007197589-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24aca9ded2638ea793d05360dde7a4a0 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-26 |
filingDate | 2006-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_382504a2ee697f4e70582c7c066711eb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_463ebb0be87cfdee625dff2b91f81a7a |
publicationDate | 2007-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2007197589-A |
titleOfInvention | Epoxy compound and cured epoxy resin |
abstract | An epoxy compound having a low melting point and easy to mix with a curing agent is provided. SOLUTION: Formula (1) (In the formula, R 1 and R 2 represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an alkoxy group having 1 to 8 carbon atoms. Y represents the following (Y-1) and (Y-2): Represents a group represented by Here, R < 3 >, R < 4 >, R < 5 > and R < 6 > represent a hydrogen atom or a C1-C8 alkyl group. Z represents a single bond, an oxygen atom or an alkylene group having 1 to 8 carbon atoms. An epoxy compound represented by [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008239568-A |
priorityDate | 2006-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 128.