http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007194404-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e23a2282d5a93a09d72cbfcd60c163af |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 |
filingDate | 2006-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_003b1f66e6a67d4cb0f6906c3982ee0f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74defdbd2d04136d9f29dab7cdafe259 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ddecb580b2c015170566d730ecb0f04 |
publicationDate | 2007-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2007194404-A |
titleOfInvention | Flexible circuit board and manufacturing method thereof |
abstract | PROBLEM TO BE SOLVED: To provide a flexible circuit board which imparts excellent peel strength by a sputtering method and reduces pinholes. A flexible circuit board is formed on a base, a chromium coating layer formed on the base, a first coating unit formed on the chromium coating layer, and a first coating unit. The first copper coating layer 4 and the second copper coating layer 6 joined to the first copper coating layer 4, and the method of manufacturing the flexible circuit board forms the chromium coating layer 2 on the base 1. A step, forming a first coating unit 3 on the chromium coating layer 2, forming a first copper coating layer 4 on the first coating unit 3, and a second side surface 42 of the first copper coating layer 4. And performing a plasma surface treatment, and forming a second copper coating layer 6 on the first copper coating layer 4. [Selection] Figure 1 |
priorityDate | 2006-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.