http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007194118-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-26 |
filingDate | 2006-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a63a966614900fe49320d777f982871f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_779c5477263d43cc50b7f29f171bb1d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_30a2f50ca4006d37a820fc9159444942 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25cd9b1ebb0a4e48b3afc34c7d9be5be |
publicationDate | 2007-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2007194118-A |
titleOfInvention | Method for forming conductive pattern, composition for forming conductive pattern, and electronic component having conductive pattern |
abstract | The present invention provides a method for forming a conductive pattern having excellent conductivity and a high cross-sectional aspect ratio on a substrate surface, and a composition used in the method. A step of supplying a liquid composition for forming a conductive pattern to a container having an exposed surface, a step of immersing a substrate having a surface on which a conductive pattern is formed in the composition, an exposed surface and a base A step of arranging a substrate so that a composition layer having a predetermined thickness is interposed between the surface of the material, exposing the composition layer through a mask, and forming a cured product layer having a predetermined pattern; The substrate is moved so that a new composition layer having a predetermined thickness is interposed between the surface of the formed cured product layer, and the composition layer is exposed through a mask to form a cured product layer having a predetermined pattern. Further, the conductive pattern having a step of forming the laminated film of the cured product layer by performing the forming operation at least once, a step of removing the uncured composition from the surface of the substrate, and a step of heat-treating the laminated film Forming method and conductive pattern forming set used in the method Things. [Selection] Figure 1 |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013183155-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113660781-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012225998-A |
priorityDate | 2006-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 145.