| abstract |
A semiconductor device mounting substrate capable of preventing the occurrence of disconnection of wire leads, wiring, and the like, and a semiconductor device using the same, without causing IC chip separation even when subjected to a thermal shock such as a thermal cycle In addition, an electronic device is provided. A semiconductor element mounting substrate is a substrate for mounting an IC chip, and includes a substrate body. The substrate body 11 has a mounting surface 11a, and a die pattern 12 is provided at the center of the mounting surface 11a. On the outside of the die pattern 12, penetrating conductor portions 14, 14,... Are provided penetrating in the substrate thickness direction. A first terminal portion 13 and a second terminal portion 15 are connected to each through conductor portion 14, and each first terminal portion 13 extends toward the periphery of the mounting surface 11a and is electrically connected to the IC chip. Is done. Each 2nd terminal part 15 is provided in the surface on the opposite side to the mounting surface 11a. [Selection] Figure 1 |