http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007180448-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y99-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82Y10-00 |
| filingDate | 2005-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9cc9ccffa31b8a092f6edd7dcb7a989 |
| publicationDate | 2007-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007180448-A |
| titleOfInvention | Polishing method |
| abstract | The present invention provides a polishing method capable of suppressing dishing with a low amount of polishing liquid used in chemical mechanical polishing (CMP) of a film to be processed in a manufacturing process of a semiconductor device. A metal polishing liquid containing colloidal silica particles having a primary particle diameter of 5 to 60 nm and an association degree of 10 or less is in a range where the flow rate is 0.035 to 0.25 ml / min ยท cm 2 . A polishing method comprising polishing while bringing the polishing pad into contact with the surface to be polished of the object to be polished and supplying the polishing pad on the polishing surface plate with relative movement. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6301571-B1 |
| priorityDate | 2005-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 339.