http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007173295-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00 |
| filingDate | 2005-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_666680f5646defad712fcf627b36cc16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76396800c82b6f14876491ac4b33c4c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b994a9d0e27dfe5ee5ea5b24920afde |
| publicationDate | 2007-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007173295-A |
| titleOfInvention | Semiconductor device |
| abstract | PROBLEM TO BE SOLVED: To provide a semiconductor device which does not cause distortion or poor connection due to a thermal history during manufacture or use. A semiconductor device in which a semiconductor chip is mounted on a semiconductor having an area of 50 mm 2 or more, uses a polyimide film having a curl degree of 10% or less at 300 ° C. as an insulating substrate, and has two conductor layers. A semiconductor device in which a plurality of semiconductor chips are mounted on a printed wiring board having more than one layer. [Selection figure] None |
| priorityDate | 2005-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 182.