Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
filingDate |
2005-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76396800c82b6f14876491ac4b33c4c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_666680f5646defad712fcf627b36cc16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b994a9d0e27dfe5ee5ea5b24920afde |
publicationDate |
2007-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2007173294-A |
titleOfInvention |
Semiconductor device |
abstract |
PROBLEM TO BE SOLVED: To provide a semiconductor device which does not cause distortion or poor connection due to a thermal history during manufacture or use. A semiconductor device on which a semiconductor chip having a power consumption of 20 watts or more is mounted, uses a polyimide film having a curl degree of 10% or less at 300 ° C. as an insulating substrate, and has two conductor layers. A semiconductor device in which a plurality of semiconductor chips are mounted on a printed wiring board. [Selection figure] None |
priorityDate |
2005-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |