| abstract |
In a wireless chip having a thin film, a problem in crimping an antenna is improved. A wireless chip made of a thin film is formed. In particular, the wireless chip has a memory region having an organic compound layer, and the distance between one end of the memory region and one end of the pad is set to 500 μm or more. As a result, data can be written without being affected by stress or heat during antenna crimping. As a substrate on which such a wireless chip is provided, a glass substrate or a silicon wafer can be used. [Selection] Figure 1 |