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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
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filingDate 2005-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7f421f8bbde1a7daafd1a7ed857dd8d
publicationDate 2007-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007165674-A
titleOfInvention Copper foil for flexible printed wiring boards for COF
abstract PROBLEM TO BE SOLVED: To have high transparency of polyimide film after etching, high peel strength, no corrosion of copper foil-polyimide film interface after immersion in active treatment solution, and long-term reliability of peel strength A copper foil for a flexible printed wiring board for COF and a method for producing the same are provided. SOLUTION: A surface of a copper foil bonded to a polyimide film has a heat and rust preventive layer made of cobalt and / or nickel containing at least one of molybdenum, tungsten, phosphorus and germanium, and the heat resistance -It has a chromate film layer on the rust preventive layer, and has a layer made of a silane coupling agent and phosphorus or a phosphorus compound on the chromate film layer, and the adhesive surface is Gs (85 ° based on JIS Z 8471). A flexible printed wiring board for COF is produced using a copper foil having a characteristic that the specular gloss measured in step 1) is 100 or more. [Selection figure] None
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