Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2973a1bdaf87d5184fb1e81ebe5d061 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3472 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L59-00 |
filingDate |
2005-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46cdba4a0cb58dccd4451b22b3a0e7a2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ceced2b02139ca6a95c1534bb5c73f3 |
publicationDate |
2007-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2007145979-A |
titleOfInvention |
POLYACETAL RESIN COMPOSITION AND MOLDED ARTICLE |
abstract |
Disclosed is a polyacetal resin composition capable of suppressing the amount of formaldehyde generated to an extremely low level and suppressing mold deposits derived from additives. SOLUTION: (A) 0.01 to 5.0 parts by weight of a specific triazole compound and (C) 0.01 to 5.0 parts by weight of a hindered phenol antioxidant are blended with 100 parts by weight of a polyacetal resin. [Selection figure] None |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012255115-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010031200-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009113536-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5685940-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11485856-B2 |
priorityDate |
2005-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |