http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007145938-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
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filingDate 2005-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9e85666278ad8dadac05a7eb7b65c29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de232b82988fd389d8bd23046e9ff4a5
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publicationDate 2007-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007145938-A
titleOfInvention Epoxy resin composition and electronic component device
abstract PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in solder resistance, having excellent fluidity during molding, high glass transition temperature in a cured product, no bleeding out of additives and the like, and an electronic component device using the same provide. An epoxy resin composition comprising an epoxy resin (A), a curing agent (B), and a polyether compound (C) represented by the following general formula (1) as essential components. X-(-YZ) n (1) (In formula (1), X represents a polyether unit. Z represents a unit having an aromatic ring, and when there are a plurality of units, they may be the same or different from each other. Y represents a linking group and has a plurality. In this case, they may be the same or different, and n is an integer of 1 or more.)
priorityDate 2005-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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