http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007138059-A

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filingDate 2005-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b2a2302481868d342bd5435d3f4e386
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publicationDate 2007-06-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007138059-A
titleOfInvention High adhesion polyimide film and method for producing the same
abstract A highly adhesive polyimide film having improved adhesion to a copper foil and excellent in dimensional stability and water wettability and a method for producing the same are provided. A polyimide film formed from 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, and pyromellitic dianhydride, wherein the film has a 200 ° C. heat shrinkage ratio in the machine transport direction (MD). The surface roughness Ra of the film surface measured with a stylus type surface roughness meter is 0.060 μm or more, Rmax is 1.0 μm or more, and the contact angle method. A highly adhesive polyimide film having a surface free energy measured on the basis of 75 mN / m or more. [Selection figure] None
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9512337-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010138313-A
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