| abstract |
Provided is a lead-free solder paste that is excellent in viscosity stability over time, reduces flux scattering and decomposition in a soldering process, and obtains a soldered state free from voids. Moreover, the lead-free solder paste which can obtain the mounting substrate with high reliability about a circuit conductor is provided. In a solder paste containing a lead-free solder powder, a resin component, an activator, a solvent, and a thixotropic agent used when soldering an electronic component to a circuit board, a low molecular dibasic acid dialkyl ester is used. Solder paste composition containing a system compound. [Selection figure] None |