http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007131946-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7a37d7a7385924dd55e29ac1e96d1492 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2006-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65b84753fbc89947fd9ff7533b0108d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5966ab6673fa858e47f4a7e7ed92814a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_386a14b6bf94e3f8b172391c0afef1f9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ce9df719e92a481307ef725816f669e |
| publicationDate | 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007131946-A |
| titleOfInvention | Flexible copper-clad laminate, flexible printed wiring board obtained using the flexible copper-clad laminate, film carrier tape obtained using the flexible copper-clad laminate, and semiconductor device obtained using the flexible copper-clad laminate , Method for producing flexible copper clad laminate and method for producing film carrier tape |
| abstract | The present invention provides a flexible copper-clad laminate using a low profile and high strength electrolytic copper foil as compared with a low profile electrolytic copper foil that has been supplied to the market. In order to solve the above problems, in a flexible copper clad laminate in which a resin film and an electrolytic copper foil are laminated, the surface of the electrolytic copper foil deposited has a surface roughness (Rzjis) of 1.5 μm. In the following, a flexible copper-clad laminate having a low profile glossy surface with a glossiness (Gs (60 °)) of 400 or more and having a deposited surface and a resin film bonded together is adopted. By using this flexible copper-clad laminate, it becomes easy to manufacture a flexible printed wiring board in the form of a film carrier tape such as a COF tape provided with a fine pitch circuit with a formed circuit having a pitch of 35 μm or less. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2008149772-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011009267-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012033026-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012035492-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014148742-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010058325-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9396834-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2012017967-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I560048-B |
| priorityDate | 2005-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 99.