http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007131678-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bd0cdbc5c67cf4957ed83c89140748e |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 |
| filingDate | 2005-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0109163918066a66b6b453fac52f921f |
| publicationDate | 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007131678-A |
| titleOfInvention | Epoxy resin adhesive composition and optical semiconductor adhesive using the same |
| abstract | An object of the present invention is to suppress short wavelength absorptivity, excellent in ultraviolet resistance, weather resistance, transparency and storage stability, and can be used for bonding a semiconductor device mounting an optical semiconductor chip and various parts. An epoxy resin adhesive composition that has applicability and is excellent in transmission of wavelengths emitted from an optical semiconductor, and an adhesive for optical semiconductors using the same. SOLUTION: An alicyclic epoxy compound (A), a silane compound (B) containing a hydrolyzable group directly bonded to a silicon atom, a divalent organic tin compound (c1), and a tetravalent organic tin compound (c2). ) And an optically transparent inorganic filler (D) as an essential component, an epoxy resin composition used for an optical semiconductor, wherein the content of each component is based on the total amount of the composition, and (A) is 30 to 95. % By weight, 0.1 to 15% by weight of (B), 0.01 to 5% by weight of (c1), 0.01 to 5% by weight of (c2), and 0.1 to 50% by weight of (D) Provided by an epoxy resin adhesive composition characterized in that [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010047741-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009263611-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014012856-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011111550-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014162885-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010047740-A |
| priorityDate | 2005-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 138.