abstract |
PROBLEM TO BE SOLVED: To provide a method for forming a bump which does not contain wet chemical substances at low cost. SOLUTION: A method of forming a multilayer bump on a substrate includes a step of depositing a first metal powder on the substrate, and a first bump 150 is formed by selectively melting or reflowing a part of the first metal powder. Including the step of. Next, the second metal powder is deposited on the first bump and melted to form the second bump. The masking plate 232 is disposed on the substrate to select a portion of the metal powder that is melted via the irradiation beam 240. Multi-layer bumps are formed without the need for wet chemicals. [Selection] Figure 5 |