| abstract |
The present invention provides a silicone gel composition that provides a cured product having a low elastic modulus and a low stress and excellent in adhesiveness. (A) 100 parts by mass of an organopolysiloxane having one or more silicon-bonded alkenyl groups in one molecule; (B-1) an organohydrogenpolysiloxane having two molecular chain non-terminal SiH groups in one molecule, such that the number of SiH groups is 0.1 to 1.5 per alkenyl group, (B-2) an organohydrogenpolysiloxane having 3 or more SiH groups in one molecule, such that the number of SiH groups per 0.003 alkenyl group is 0.001 to 0.2, (B-3) Organohydrogenpolysiloxane having two molecular chain terminal SiH groups in one molecule, and an amount in which the number of SiH groups per alkenyl group is 1.0 or less, and (C) a platinum-based catalyst. A silicone gel composition comprising a total amount of SiH groups of 0.5 to 2.0 per alkenyl group. [Selection figure] None |