http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007119611-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-10 |
| filingDate | 2005-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0245fa0ca5df887887b3065c118d7653 |
| publicationDate | 2007-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007119611-A |
| titleOfInvention | Phenolic resin composition |
| abstract | [Problem] To provide a phenolic resin composition which has an excellent balance between curing speed and heat resistance without substantially using hexamethylenetetramine, and does not inhibit curing even when a basic filler is blended. SOLUTION: A phenolic resin composition characterized by comprising a novolac type phenolic resin (a), a polyacetal resin (b), and an organic base compound (c) as essential components and substantially free of hexamethylenetetramine. Preferably, the organic base compound (c) contains phosphorus and / or nitrogen, and the organic base compound (c) further contains a compound having a boiling point of 150 ° C. or higher. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102317363-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010092012-A1 |
| priorityDate | 2005-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.