| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4d72711e97d894c55af805c9de2053ab |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31053 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2006-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_be2c1952c8adf91e551286146c61dfe9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c1ea88bdc6b3aca45374451675cbf80 |
| publicationDate |
2007-05-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007116105-A |
| titleOfInvention |
Polymer barrier removal polishing slurry |
| abstract |
To achieve modular removal of barriers to ultra-low-k insulating materials while increasing copper removal rate. An aqueous slurry is useful for chemical mechanical polishing of a semiconductor substrate having copper wiring. The aqueous slurry contains 0.01 to 25% by weight of an oxidizing agent, 0.1 to 50% by weight of silica abrasive grains, 0.001 to 3% by weight of polyvinyl pyrrolidone, and an inhibitor 0.01 to reduce static etching of copper wiring. 10% by weight, phosphorus-containing compound 0.001 to 5% by weight for increasing the removal rate of copper wiring, acid complexing agent 0.001 to 10% by weight formed during polishing and the balance water, and at least 8% Having a pH of [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009049402-A |
| priorityDate |
2005-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |