http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007106964-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2005-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3a3c8b972120fefdae22445236dff1f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8143b1dddf3e66be8e2e70ac832b4718 |
| publicationDate | 2007-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007106964-A |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same |
| abstract | Provided is an epoxy resin composition for semiconductor encapsulation having excellent adhesion to a lead frame, particularly a lead frame plated with nickel / palladium / gold (Ni / Pd / Au) and having excellent solder resistance. To do. An epoxy resin composition for semiconductor encapsulation containing the following components (A) to (D). And the content of sulfur which is the said (D) component is set in the range of 0.01 to 1.0 weight% of the whole epoxy resin composition. (A) Epoxy resin. (B) Curing agent. (C) Inorganic filler. (D) Sulfur. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007211060-A |
| priorityDate | 2005-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.