http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007106951-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0ddb9f3656270bc5410be3679322fead |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J7-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate | 2005-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_951eac4d42a2c7c2bcf6fb788bdb44f2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b87c23f8a5120ca434a57127639a1f17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e6190cc58869aa8800bde44f1a30f53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44e53f1d5e0ecc1e19bc04a31eb398bb |
| publicationDate | 2007-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007106951-A |
| titleOfInvention | Solutions, direct plating materials and printed wiring boards |
| abstract | The present invention relates to a material for direct plating that can be suitably used in the production of printed wiring boards, etc., and a metal formed by direct plating formed on the surface even when the surface roughness of the material is small Provided are a material for direct plating and a solution excellent in adhesion to a layer, and a printed wiring board using the same. A material for direct plating having at least a surface a for forming a metal layer by direct plating, wherein the surface roughness of the surface a is an arithmetic average roughness measured at a cutoff value of 0.002 mm. The surface a contains a polyimide resin having one or more structures among the structures represented by any one of the general formulas (1) to (6). The above-described problems can be solved by the direct plating material. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013171827-A1 |
| priorityDate | 2005-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 199.