http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007105836-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
filingDate 2005-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86617ac0bc0c7d86bfc0f0a1ad1e0266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_62f9097e111dcb2011e5878774f1e5e6
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publicationDate 2007-04-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007105836-A
titleOfInvention Polishing pad and polishing apparatus
abstract In a polishing pad used for forming a flat surface in glass, semiconductor, dielectric / metal composite, integrated circuit, etc., scratches are hardly generated on the substrate surface, and the polishing state is optically good during polishing. Provided are a polishing pad and a polishing apparatus capable of measuring the above. A polishing pad having a polishing layer 1 and having a through-hole 14 communicating with the polishing surface and the back surface, and having a path 15 communicating with the through-hole and the side surface of the polishing pad. The polishing apparatus is equipped with such a polishing pad. [Selection] Figure 3
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010023134-A
priorityDate 2005-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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