| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36d1d9c59848bff6ad5f55923d1290f5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-067 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 |
| filingDate |
2005-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f47c3fc9272cb8f23278cd06cc8791f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d9094d8da595e91624bbd679870850b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_089d56d5c70996eb222d09164b9dcba3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_22cdab45fdcfea213bc88474ce8f180c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00eca38aa371ab8099f122355777fdb2 |
| publicationDate |
2007-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007101373-A |
| titleOfInvention |
Probe sheet bonding holder, probe card, semiconductor inspection apparatus, and semiconductor device manufacturing method |
| abstract |
An inspection apparatus capable of collectively inspecting a plurality of semiconductor elements having a narrow pitch electrode structure. A probe sheet having a contact terminal 4a in contact with an electrode 3 provided on a wafer 1, a lead wire 4c routed from the contact terminal 4a, and an electrode 4d electrically connected to the lead wire 4c. In the probe card having the multilayer wiring board 50 having the electrode 50a electrically connected to the electrode 4d of the probe sheet 4, the contact between the contact terminal 4a and the electrode 3 of the wafer 1 is a terminal group of the contact terminal 4a. From the back surface, one or a plurality of adhesive holders 5 are applied to the terminal group by applying pressure to the terminal group via a pressing block 5b having a spring 5a. An apparatus for bonding the probe sheet 4 to the adhesive holder 5 and combining the adhesive holder 5 to inspect a plurality of chips simultaneously is configured. [Selection] Figure 2 |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7688086-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010266322-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102043071-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112649711-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112649711-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009204393-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101726399-B1 |
| priorityDate |
2005-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |