| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 |
| filingDate |
2005-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_34deea97e034773b644a785d39058a8b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0f182a2db726f0e3387c9657d56fe62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffaa8362dccf51ceab3721ecb2e8bc17 |
| publicationDate |
2007-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007099849-A |
| titleOfInvention |
Resin composition, method for producing heat-resistant resin, and electronic component using the same |
| abstract |
The present invention provides a resin composition in which the resulting heat-resistant resin has good insulation and chemical resistance even when heat-treated at a low temperature of 80 to 200 ° C. A resin composition comprising (a) an aromatic polyimide and (b) an epoxy compound represented by the general formula (1). [Chemical 1] (In the formula, R 1 represents an organic group having 1 to 16 carbon atoms, R 2 independently represents a direct bond or a divalent organic group. N represents an integer of 3 or more.) [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016027085-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111592760-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115246930-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115246930-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114262499-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111592760-A |
| priorityDate |
2005-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |