| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-24 |
| filingDate |
2005-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45019dfacfbb141577b17a44bb501b72
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f1ca28cdf4438f7fccfc107589a7e28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e6952b19693b1a6694422176309eadd |
| publicationDate |
2007-04-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2007099808-A |
| titleOfInvention |
Epoxy resin composition and semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide an area mounting type semiconductor sealing epoxy resin composition that maintains flame retardancy and suppresses warpage of a semiconductor device at -55 ° C to 260 ° C, and a semiconductor device using the same. SOLUTION: An epoxy resin (A-1) represented by the general formula (1) and / or an epoxy resin (A-2) represented by the formula (2) and a phenol resin represented by the general formula (3) (B-1) and / or triaminophenyl (B-2) represented by formula (4), zinc molybdate (C-1) and / or zinc borate (C-2), and crystalline silica (D ) And a semiconductor element mounted on one side of the substrate, and substantially only one side of the substrate side on which the semiconductor element is mounted is the above-mentioned area mounting type semiconductor sealing epoxy It is an area mounting type semiconductor device sealed using a resin composition. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019102782-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011118584-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016148054-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2018044177-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9206308-B2 |
| priorityDate |
2005-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |