http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007091973-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2973a1bdaf87d5184fb1e81ebe5d061 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-25 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-25 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L59-00 |
| filingDate | 2005-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ceced2b02139ca6a95c1534bb5c73f3 |
| publicationDate | 2007-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007091973-A |
| titleOfInvention | POLYACETAL RESIN COMPOSITION AND MOLDED ARTICLE |
| abstract | PROBLEM TO BE SOLVED: To provide a stable polyacetal resin composition that suppresses the amount of formaldehyde generated to an extremely low level and does not adversely affect other resin molded products that coexist in a sealed space. (A) Polyacetal resin It comprises 0.01 to 5.0 parts by weight of (B) carboxylic acid hydrazide compound with respect to 100 parts by weight, and the carboxylic acid hydrazide compound (B) generates hydrazine in a headspace GC / MS method by heating at 200 ° C. for 10 minutes. A polyacetal resin composition, characterized in that the amount is 10 ppm or less. [Selection figure] None |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8765850-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010050187-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011080011-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008260874-A |
| priorityDate | 2005-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 531.