| abstract |
Provided is a resin composition for encapsulating an optical semiconductor element, which has high light transmittance and moderate light diffusibility, and is capable of reducing internal stress. An epoxy resin composition for sealing an optical semiconductor element containing the following components (A) to (C). (A) An epoxy resin containing an epoxy compound represented by the following structural formula (1) as a main component. (B) Curing agent. (C) At least one of an oxynitride phosphor and a nitride phosphor. [Selection figure] None |