http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007091820-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153
classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3477
filingDate 2005-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e24e769457dcbcc2e502407af5706cbf
publicationDate 2007-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2007091820-A
titleOfInvention Thermosetting resin composition and thermosetting resin molding material
abstract PROBLEM TO BE SOLVED: To provide a thermosetting resin composition and a thermosetting resin molding material having a very fast curing speed. A thermosetting resin composition comprising, as essential components, a novolac-type phenol resin (a), hexamethylenetetramine (b), and a polymer (c) that releases hydrogen ions. A thermosetting resin composition, wherein the polymer (c) releasing hydrogen ions is a hydrogen cation exchange resin. The thermosetting resin composition in which the polymer (c) that releases hydrogen ions contains a sulfone group as a functional group. A thermosetting resin molding material comprising the thermosetting resin composition and a filler.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019172741-A
priorityDate 2005-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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